HiPerFAST
TM
IGBT
with HiPerFRED
Buck & boost configurations
IXGN 50N60BD2
IXGN 50N60BD3
V
CES
I
C25
V
CE(sat)
t
fi
= 600 V
= 75 A
= 2.5 V
= 150 ns
...BD2
Symbol
V
CES
V
CGR
V
GES
V
GEM
IGBT
...BD3
Maximum Ratings
600
600
鹵20
鹵30
75
50
200
I
CM
= 100
@ 0.8 V
CES
250
600
60
600
150
-40 ... +150
150
-40 ... +150
V
V
V
V
4
Test Conditions
T
J
= 25擄C to 150擄C
T
J
= 25擄C to 150擄C; R
GE
= 1 MW
Continuous
Transient
T
C
= 25擄C
T
C
= 90擄C
T
C
= 25擄C, 1 ms
SOT-227B, miniBLOC
E 153432
2
1
I
C25
I
C90
I
CM
A
A
A
A
W
V
A
A
W
擄C
擄C
擄C
IXGN50N60BD2
1 = Emitter; 2 = Gate
3 = Collector; 4 = Diode cathode
3
SSOA
V
GE
= 15 V, T
VJ
= 125擄C, R
G
= 10
W
(RBSOA)
Clamped inductive load, L = 30
mH
P
C
V
RRM
Diode
T
C
= 25擄C
T
C
= 70擄C; rectangular, d = 50%
t
P
z<10 ms; pulse width limited by T
J
T
C
= 25擄C
IXGN50N60BD3
1 = Emitter/Diode Cathode; 2 = Gate
3 = Collector; 4 = Diode anode
I
FAVM
I
FRM
P
D
T
J
T
JM
T
stg
Features
鈥?International standard package
miniBLOC
鈥?Aluminium nitride isolation
- high power dissipation
鈥?Isolation voltage 3000 V~
鈥?Very high current, fast switching
IGBT & FRED diode
鈥?MOS Gate turn-on
- drive simplicity
鈥?Low collector-to-case capacitance
鈥?Low package inductance (< 10 nH)
- easy to drive and to protect
鈥?Molding epoxies meet UL 94 V-0
flammability classification
Applications
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
AC motor speed control
DC servo and robot drives
DC choppers
Buck converters
Case
M
d
Weight
Mounting torque
Terminal connection torque (M4)
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
30
300
g
擄C
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Symbol
Test Conditions
Characteristic Values
(T
J
= 25擄C, unless otherwise specified)
min. typ. max.
600
2.5
T
J
= 25擄C
T
J
= 125擄C
5
200
1
鹵100
2.5
V
V
mA
mA
nA
V
BV
CES
V
GE(th)
I
CES
I
GES
V
CE(sat)
I
C
I
C
= 250
mA,
V
GE
= 0 V
= 250
mA,
V
CE
= V
GE
V
CE
= 0.8 鈥?V
CES
V
GE
= 0 V
V
CE
= 0 V, V
GE
=
鹵20
V
I
C
= I
C90
, V
GE
= 15 V
Advantages
鈥?Easy to mount with 2 screws
鈥?Space savings
鈥?High power density
98502C (8/99)
IXYS reserves the right to change limits, test conditions, and dimensions.
漏 2000 IXYS All rights reserved
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