ISL5729IN Datasheet

IC型號(hào)：
ISL5729IN
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Dual 10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A ...
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ISL5729

Data Sheet

February 2002

FN6019.1

Dual 10-bit, +3.3V, 130/210+MSPS,

CommLink

High Speed D/A Converter

The ISL5729 is a dual 10-bit,

130/210+MSPS (Mega Samples

Per Second), CMOS, high speed,

low power, D/A (digital to analog) converter, designed

speci鏗乧ally for use in high performance communication

systems such as base transceiver stations utilizing 2.5G or

3G cellular protocols.

This device complements the CommLink ISL5x61 and

ISL5x29 families of high speed converters, which include 8-,

10-, 12-, and 14-bit devices.

Features

鈥?Speed Grades . . . . . . . . . . . . . . . . 130M and 210+MSPS

鈥?Low Power . . . . . 233mW with 20mA Output at 130MSPS

鈥?Adjustable Full Scale Output Current . . . . . 2mA to 20mA

鈥?Guaranteed Gain Matching < 0.14dB

鈥?+3.3V Power Supply

鈥?3V LVCMOS Compatible Inputs

鈥?Excellent Spurious Free Dynamic Range

(70dBc to Nyquist, f

= 130MSPS, f

OUT

= 10MHz)

鈥?UMTS Adjacent Channel Power = 65dB at 19.2MHz

鈥?EDGE/GSM SFDR = 83dBc at 11MHz in 20MHz Window

鈥?Dual, 3.3V, Lower Power Replacement for AD9763

Ordering Information

PART

NUMBER

ISL5729IN

ISL5729/2IN

ISL5729EVAL1

TEMP.

RANGE

(

-40 to 85

PACKAGE

48 Ld LQFP

CLOCK

PKG. NO. SPEED

Q48.7x7A 130MHz

Q48.7x7A 210MHz

210MHz

Applications

鈥?Cellular Infrastructure - Single or Multi-Carrier: IS-136,

IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA

鈥?BWA Infrastructure

鈥?Quadrature Transmit with IF Range 0鈥?0MHz

Evaluation Platform

Pinout

ISL5729

(LQFP)

TOP VIEW

ID9 (MSB)

QD0 (LSB)

鈥?Medical/Test Instrumentation and Equipment

鈥?Wireless Communication Systems

ID7

ID8

ID4

ID3

ID2

ID1

(LSB) ID0

SLEEP

VDD

AGND

ICOMP

48 47 46 45 44 43 42 41 40 39 38 37

13 14 15 16 17 18 19 20 21 22 23 24

QD1

ID5

ID6

QD2

QD3

QD4

QD5

QD6

QD7

QD8

QD9 (MSB)

CLK

DGND

AGND

QCOMP

REFLO

AGND

FSADJ

IOUTA

IOUTB

QOUTB

QOUTA

REFIO

VDD

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 321-724-7143

Intersil and Design is a trademark of Intersil Americas Inc.

CommLink鈩?is a trademark of Intersil Americas Inc.

標(biāo)準(zhǔn)包裝
250
類(lèi)別
集成電路 (IC)
家庭
數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器
系列
-
設(shè)置時(shí)間
-
位數(shù)
10
數(shù)據(jù)接口
并聯(lián)
轉(zhuǎn)換器數(shù)目
2
電壓電源
模擬和數(shù)字
功率耗散（最大）
274mW
工作溫度
-40°C ~ 85°C
安裝類(lèi)型
表面貼裝
封裝/外殼
48-LQFP
供應(yīng)商設(shè)備封裝
48-TQFP（7x7）
包裝
托盤(pán)
輸出數(shù)目和類(lèi)型
4 電流，單極
采樣率（每秒）
130M

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