PD - 91732A
IRG4RC10S
INSULATED GATE BIPOLAR TRANSISTOR
Features
鈥?Extremely low voltage drop; 1.0V typical at 2A, 100擄C
鈥?Standard: Optimized for minimum saturation
voltage and low operating frequencies ( < 1kHz)
鈥?Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
previous generation
鈥?Industry standard TO-252AA package
C
Standard Speed IGBT
V
CES
= 600V
G
E
V
CE(on) typ.
= 1.10V
@V
GE
= 15V, I
C
= 2.0A
n-channel
Benefits
鈥?Generation 4 IGBT's offer highest efficiency available
鈥?IGBT's optimized for specified application conditions
D-PAK
TO-252AA
Absolute Maximum Ratings
Parameter
V
CES
I
C
@ T
C
= 25擄C
I
C
@ T
C
= 100擄C
I
CM
I
LM
V
GE
E
ARV
P
D
@ T
C
= 25擄C
P
D
@ T
C
= 100擄C
T
J
T
STG
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
聛
Clamped Inductive Load Current
聜
Gate-to-Emitter Voltage
Reverse Voltage Avalanche Energy
聝
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
600
14
8.0
18
18
鹵 20
110
38
15
-55 to + 150
300 (0.063 in. (1.6mm) from case )
Units
V
A
V
mJ
W
擄C
Thermal Resistance
Parameter
R
胃JC
R
胃JA
Wt
Junction-to-Case
Junction-to-Ambient (PCB mount)*
Weight
Typ.
鈥撯€撯€?/div>
鈥撯€撯€?/div>
0.3 (0.01)
Max.
3.3
50
鈥撯€撯€?/div>
Units
擄C/W
g (oz)
* When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994
www.irf.com
1
8/30/99
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