board space saving solution for switching regulator and power management applications. Advanced
餂?/div>
MOSFETs combined with low forward drop Schottky results in an extremely efficient device suitable
for a wide variety of portable electronics applications.
The SO-14 has been modified through a customized leadframe for enhanced thermal characteristics and
multiple die capability making it ideal in a variety of power applications. With these improvements multiple
devices can be used in an application with dramatically reduced board space. Internal connections enable
easier board layout design with reduced stray inductance.
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
V
GS
E
AS
(6 sigma)
T
J
T
STG
Drain-Source Voltage
Continuous Drain Current, V
GS
@ 10V聞
Continuous Drain Current, V
GS
@ 10V聞
Pulsed Drain Current
聛
Power Dissipation
聝
Power Dissipation聝
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
聟
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
30
10
8.1
81
2.0
1.3
0.02
鹵 12
50
-55 to + 150
300 (1.6mm from case )
Units
V
A
W
W/擄C
V
mJ
擄C
Thermal Resistance
Symbol
R
胃JL
R
胃JA
Parameter
Junction-to-Drain Lead
Junction-to-Ambient
聝
Typ.
Max.
20
62.5
Units
擄C/W
Notes
聛
through
聟
are on page 12
9/11/02