PD - 9.1568B
PRELIMINARY
l
l
l
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IRF7317
HEXFET
廬
Power MOSFET
D1
D1
D2
D2
Generation V Technology
Ultra Low On-Resistance
Dual N and P Channel MOSFET
Surface Mount
Fully Avalanche Rated
S1
G1
S2
G2
N -C H A N N EL M O S FET
1
8
N-Ch
V
DSS
20V
P-Ch
-20V
2
7
3
6
4
5
P -C H AN N E L MO S FET
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements,
multiple devices can be used in an application with
dramatically reduced board space. The package is
designed for vapor phase, infra red, or wave soldering
techniques.
R
DS(on)
0.029鈩?0.058鈩?/div>
T o p V ie w
S O -8
Absolute Maximum Ratings ( T
A
= 25擄C Unless Otherwise Noted)
Symbol
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
聟
T
A
= 25擄C
T
A
= 70擄C
V
DS
V
GS
I
D
I
DM
I
S
P
D
E
AS
I
AR
E
AR
dv/dt
T
J,
T
STG
100
4.1
0.20
5.0
-5.0
-55 to + 150 擄C
N-Channel
20
6.6
5.3
26
2.5
2.0
1.3
150
-2.9
Maximum
P-Channel
-20
鹵 12
-5.3
-4.3
-21
-2.5
Units
V
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
T
A
= 25擄C
Maximum Power Dissipation
聟
T
A
= 70擄C
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
聜
Junction and Storage Temperature Range
A
W
mJ
A
mJ
V/ ns
Thermal Resistance Ratings
Parameter
Maximum Junction-to-Ambient
聟
Symbol
R
胃JA
Limit
62.5
Units
擄C/W
12/9/97
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