PD - 95823A
IRF6620
l
Application Specific MOSFETs
l
Ideal for CPU Core DC-DC Converters
l
Low Conduction Losses
l
Low Switching Losses
l
Low Profile (<0.7 mm)
l
Dual Sided Cooling Compatible
l
Compatible with Existing Surface Mount
Techniques
HEXFET
廬
Power MOSFET
V
DSS
20V
R
DS(on)
max
2.7m鈩V
GS
= 10V
3.6m鈩V
GS
= 4.5V
Qg(typ.)
28nC
MX
Applicable DirectFET Outline and Substrate Outline (see p.8,9 for details)
SQ
SX
ST
MQ
MX
MT
DirectFET聶 ISOMETRIC
Description
The IRF6620 combines the latest HEXFET廬 Power MOSFET Silicon technology with the advanced DirectFET
TM
packaging to achieve the
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering tech-
niques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual
sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6620 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching
losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors
operating at higher frequencies. The IRF6620 has been optimized for parameters that are critical in synchronous buck operating from 12 volt
buss converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6620 offers particularly low Rds(on) and high
Cdv/dt immunity for synchronous FET applications.
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
C
= 25擄C
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
P
D
@T
C
= 25擄C
E
AS
I
AR
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Power Dissipation
Single Pulse Avalanche Energy
Avalanche Current
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Max.
20
鹵20
150
27
22
220
2.8
1.8
89
39
22
0.017
-40 to + 150
Units
V
A
g
g
聶
W
mJ
A
W/擄C
擄C
脙聶
d
Thermal Resistance
R
胃JA
R
胃JA
R
胃JA
R
胃JC
R
胃J-PCB
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
fj
gj
hj
ij
Parameter
Typ.
鈥撯€撯€?/div>
12.5
20
鈥撯€撯€?/div>
1.0
Max.
45
鈥撯€撯€?/div>
鈥撯€撯€?/div>
1.4
鈥撯€撯€?/div>
Units
擄C/W
Notes
聛
through
聢
are on page 2
www.irf.com
1
4/2/04
next
IRF6620 產品屬性
4,800
分離式半導體產品
FET - 單
HEXFET®
MOSFET N 通道,金屬氧化物
邏輯電平門
20V
27A
2.7 毫歐 @ 27A,10V
2.45V @ 250µA
42nC @ 4.5V
4130pF @ 10V
2.8W
表面貼裝
DirectFET? 等容 MX
DIRECTFET? MX
帶卷 (TR)
IRF6620TR
IRF6620相關型號PDF文件下載
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型號
版本
描述
廠商
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