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IBM13M64734BCA-260T Datasheet

  • IBM13M64734BCA-260T

  • x72 SDRAM Module

  • 20頁

  • ETC

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IBM11M4730C4M x 72 E12/10, 5.0V, Au.
Preliminary
Features
IBM13M64734BCA
64M x 72 1 Bank Registered/Buffered SDRAM Module
鈥?168-Pin Registered 8-Byte Dual In-Line Memory
Module
鈥?64Mx72 Synchronous DRAM DIMM
鈥?Performance:
-260 CL=2 -360 CL=3 -360 CL=2
Units
Reg. Buff. Reg. Buff Reg. Buff.
DIMM CAS Latency
3
2
4
3
3
2
f
CK
Clock Frequency 100 100 100 100
f
CK
Clock Cycle
t
AC
Clock Access
10
7.2
10
7.2
10
7.2
10
66
15
66
15
MHz
ns
ns
7.2 10.2 10.2
鈥?Intended for 66/100MHz and PC100 applica-
tions
鈥?Inputs and outputs are LVTTL (3.3V) compatible
鈥?Single 3.3V
鹵
0.3V Power Supply
鈥?Single Pulsed RAS interface
鈥?SDRAMs have four internal banks
鈥?Module has one physical bank
鈥?Fully Synchronous to positive Clock Edge
鈥?Programmable Operation:
- DIMM CAS Latency: 3, 4 (Registered
mode); 2, 3 (Buffered mode)
- Burst Type: Sequential or Interleave
- Burst Length:1, 2, 4, 8
- Operation: Burst Read and Write or Multiple
Burst Read with Single Write
鈥?Data Mask for Byte Read/Write control
鈥?Auto Refresh (CBR) and Self Refresh
鈥?Automatic and controlled Precharge Commands
鈥?Suspend Mode and Power Down Mode
鈥?13/11/2 Addressing (Row/Column/Bank)
鈥?8192 refresh cycles distributed across 64ms
鈥?Card size: 5.25" x 1.70" x 0.157"
鈥?Gold contacts
鈥?SDRAMs in TSOP - Type II Package
鈥?Serial Presence Detect with Write protect
Description
IBM13M64734BCA is a registered 168-Pin Syn-
chronous DRAM Dual-In-Line Memory Module
(DIMM) organized as a 64Mx72 high-speed mem-
ory array. The DIMM uses eighteen 64Mx4
SDRAMs in 400 mil TSOP packages. The DIMM
achieves high-speed data-transfer rates of up to
100 MHz by employing a prefetch/pipeline hybrid
architecture that synchronizes the output data to a
system clock.
The DIMM is intended for use in applications oper-
ating from 66MHz to 100 MHz, PC100, memory bus
speeds, and/or heavily loaded bus applications. All
control and address signals are re-driven through
registers/buffers to the SDRAM devices. The DIMM
can be operated in either registered mode (REGE
pin tied high), where the control/address input sig-
nals are latched in the register on one rising clock
edge and sent to the SDRAM devices on the follow-
ing rising clock edge (data access is delayed by one
clock), or in buffered mode (REGE pin tied low),
where the input signals pass through the regis-
ter/buffer to the SDRAM devices on the same clock.
XTK simulation models of the DIMM are available to
determine which mode to design for.
A phase-lock loop (PLL) on the DIMM is used to re-
drive the clock signals to both the SDRAM devices
and the registers to minimize system clock loading.
(CK0 is connected to the PLL, and CK1, CK2, and
CK3 are terminated on the DIMM.) A single clock
enable (CKE0) controls all devices on the DIMM,
enabling the use of SDRAM power-down modes.
Prior to any access operation, the device CAS
latency and burst type/length/operation type must
be programmed into the DIMM by address inputs
A0-A9 using the mode register set cycle. The DIMM
CAS latency when operated in buffered mode is the
same as the device CAS latency as specified in the
SPD EEPROM. The DIMM CAS latency when oper-
ated in registered mode is one clock later due to the
address and control signals being clocked to the
SDRAM devices.
The DIMM uses serial presence detects imple-
mented via a serial EEPROM using the two-pin IIC
protocol. The first 128 bytes of serial PD data are
programmed and locked by the DIMM manufac-
turer. The last 128 bytes are available to the cus-
tomer and may be write protected by providing a
high level to pin 81 on the DIMM. (An on-board pull-
down resistor keeps this in the write-enable mode.)
All IBM 168-pin DIMMs provide a high-performance,
flexible 8-byte interface in a 5.25" long space-saving
footprint.
19L7159.E93855
2/00
漏IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 1 of 20

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