Surface Mount Schottky Diodes
Reliability Data
HSMS-8101
HSMS-820X
HSMS-286A/6X
The following cumulative test
results have been obtained from
testing performed at Hewlett-
Packard Communications Com-
ponents Division in accordance
with the latest revision of
MIL-STD-750. Data was gathered
from the product qualification,
reliability monitor, and
engineering evaluation.
For the purpose of this reliability
data sheet, a failure is any part
which fails to meet the electrical
and/or mechanical specification
listed in the Hewlett-Packard
Communications Components
Designer鈥檚 Catalog.
1. Life Test
A. Demonstrated Performance
Test
High Temp. Rev.
Bias (HTRB)
High Temp.
Operating
Life (HTOL)
High Temp.
Storage (HTS)
Test Conditions
V
R
= 80% V
BR
, T
A
= 150擄C
P
fm
= 75 mW, T
A
= 65擄C
V
R
= 80% V
BR
T
A
= 150擄C
Units
Tested
127
129
Total
Device Hrs.
127,000
129,000
Total
Failed
0
0
Failure Rate
1%/1K Hrs.
0
0
129
129,000
0
0
B. Failure Rate Prediction
The failure rate will depend on the
junction temperature of the
device. The estimated life at
different temperatures is calcu-
lated, using the Arrhenius plot
with activation energy of 1.05 eV,
and listed in the following table.
Junction
Temp.
T
J
(
擄
C)
150
140
130
120
100
75
50
Point
[1]
MTTF
(Hours)
3.6 x 10
6
7.3 x 10
6
1.5 x 10
7
3.2 x 10
7
1.7 x 10
8
1.8 x 10
9
2.6 x 10
10
FIT
[3]
278.0
137.0
67.0
31.0
6.0
0.56
0.04
90% Confidence Level
[2]
MTTF
(Hours)
1.6 x 10
6
3.2 x 10
6
6.5 x 10
6
1.4 x 10
7
7.4 x 10
7
7.8 x 10
8
1.1 x 10
10
FIT
[3]
625.0
312.0
153.0
71.0
14.0
1.3
0.09