Schottky Barrier Chips for
Hybrid Integrated Circuits
Technical Data
HSMS-0005/06
HSMS-8002/12
Features
鈥?Thermocompression/
Thermosonically Bondable
鈥?Gold Metallization
鈥?Silicon Nitride Passivation
鈥?Uniform Electrical
Characteristics
鈥?Batch Matched Versions
Available
鈥?Planar Construction
鈥?Available in Many Electrical
Selections
鈥?Ideal for Hybrid Integrated
Circuits
Description/Applications
These Schottky chips are de-
signed for hybrid applications at
DC through K-band frequencies.
The passivated planar construc-
tion of these Schottky chips
provides a wide temperature
range capability combined with
broad bandwidth performance.
A variety of chips are provided
which are optimized for various
analog and digital applications.
Typical applications of Schottky
chips are mixing, detecting,
switching, gating, sampling, and
wave shaping.
This series of Schottky diode
chips are specifically designed for
analog and digital hybrid appli-
cations requiring thermosonic or
thermocompression bonding
techniques. The large bonding pad
allows easy bonding. The top
metallization is a layer of gold
deposited on adhesive metal
layers for a tarnish-free surface
that allows either thermosonic or
thermocompression bonding
techniques. The bottom metalli-
zation is also gold, suitable for
epoxy or eutectic die attach
methods.
Chip Dimensions
X
D
Y
X
2
X
2
Z
DIMENSIONS
D
X
Y
Z
Top Contact
PART NO. HSMS-
-0006/-8002
-0005
75
55
(3)
(2)
250
250
(10)
(10)
275
250
(11)
(10)
150
150
(8)
(6)
Anode
Cathode
NOTES:
1. Dimensions in mIcrons (1/1000 inch).
2. Dimension tolerance is
鹵30碌.
3. All contact metallization is gold.
5965-8855E
3-86
1
2
3
4
