package. This RFIC would
typically serve as the 鈥渇ront end鈥?/div>
and power stage of a battery
operated wireless transceiver for
PCS or ISM band use. Each
section of the RFIC can also be
used independently.
15 Antenna
C1 14
Package Pin
Configuration
25 PA out
24 Gnd
22 PA out
21 PA out
18 SW2
27 VG2
26 Gnd
23 Gnd
20 Gnd
19 Gnd
17 Gnd
28 Gn
16 C2
Applications
鈥?Personal Communications
Systems (PCS)
鈥?Cordless Telephone Systems
鈥?2400 MHz Wireless LANs
and ISM Band Spread
Spectrum Applications
Gnd 1
Gnd 2
Gnd 3
VD1 7
LNA out 8
PA in 4
Gnd 5
Gnd 6
HPMX
3003
YYWW
Gnd 9
Gnd 10
LNA in 11
Gnd 12
SW1 13
The single-supply LNA makes use
of the low noise characteristics of
GaAs to create a matched, broad-
band amplifier with target perfor-
mance of 13 dB gain and 2.2 dB
noise figure. The switch provides
+55 dBm IP3 for linear operation.
The power amplifier produces up
to 820 mW with 35% power added
efficiency.
The HPMX-3003 is fabricated with
Hewlett-Packard鈥檚 GaAs MMIC
process, and features a nominal
0.5 micron recessed Schottky-
barrier-gate, gold metallization,
and silicon nitride passivation to
produce MMICs with superior
performance, uniformity and
reliability.
Functional Block Diagram
LNA out
C1
Antenna
C2
PA in
(VG1)
SW2
PA out
VD1
VG2
VD2
LNA in
SW1
5965-1403E
7-82