HP3-T03-CB Datasheet

IC型號：
HP3-T03-CB
PDF描述：
METAL CASE, CASE-MOUNTED SEMICONDUCTORS
文件大?。?/label>
431.37KB
PDF頁數(shù)：
6頁
芯片廠家：
CTS

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Series HP3

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

HP3 Series for Single TO-3 or Stud Mount

DESCRIPTION OF CURVES

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

鈥?/div>

Thermal Resistance Case to Sink is 0.1-0.3

擄C/W

w/Joint Compound.

Derate 1.0

擄C/watt

for unplated part in natural convection only.

Ordering Information

Unplated

HP3-000-U

HP3-T03-U

HP3-T03-33U

CTS IERC PART NO.

Comm'l. Black

Anodize

HP3-000-CB

HP3-T03-CB

HP3-T03-33CB

Mil. Black Anodize

HP3-000-B

HP3-T03-B

HP3-T03-33B

Semiconductor

Accommodated

Undrilled

T0-3

T0-3 IC

Hole patt. ref.

no.

Max. Weight

(Grams)

55.0

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