HP1-TO66-35B Datasheet

IC型號：
HP1-TO66-35B
PDF描述：
METAL CASE, CASE-MOUNTED SEMICONDUCTORS
文件大小：
541.55KB
PDF頁數(shù)：
7頁
芯片廠家：
CTS

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Series HP1

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

HP1 Series for Single TO-3 or Stud Mount Devices

DESCRIPTION OF CURVES

A. N.C. Horiz. Device

Only Mounted to G-10.

A. N.C. Horiz. & Vert.

With Dissipator.

B. 200 RPM w/Diss.

C. 500 RPM w/Diss.

E. 1000 RPM w/Diss.

鈥?/div>

Thermal Resistance Case to Sink is 0.1-0.3

擄C/W

w/Joint Compound.

Derate 1.0

擄C/watt

for unplated part in natural convection only.

Ordering Information

Unplated

IERC PART NO.

Comm鈥檒. Black

Anodize

HP1-000-CB

HP1-TO3-CB

HP1-TO3-33CB

HP1-TO3-44CB

HP1-436-CB

HP1-T06-CB

HP1-TO15-CB

HP1-420-CB

Mil. Black

Anodize

HP1-000-B

HP1-TO3-B

HP1-TO3-33B

HP1-TO3-44B

HP1-436-B

HP1-T06-B

HP1-TO15-B

HP1-420-B

Semiconductor

Accommodated

Hole patt.

Ref. No.

(see pg.

1-28)

Max. Weight

(Grams)

HP1-000-U

HP1-TO3-U

HP1-TO3-33U

HP1-TO3-44U

HP1-436-U

HP1-TO6-U

HP1-TO15-U

HP1-420-U

Undrilled

TO-3

TO-3 IC

TO-3 panel mount

TO-3 (4-pin)

TO-6, TO-36

TO-15, DO-5

Universal

35.0

型號

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