鈥?/div>
Fast access times: 2.5 ns, 3.0 ns, and 3.5 ns
Fast clock speed: 225, 200, 166, and 150 MHz
Fast OE access times: 2.5 ns, 3.0 ns, and 3.5 ns
Optimal for performance (two cycle chip deselect, depth
expansion without wait state)
3.3V 鈥?% and +10% power supply
3.3V or 2.5V I/O supply
5V tolerant inputs except I/Os
Clamp diodes to V
SS
at all inputs and outputs
Common data inputs and data outputs
Byte Write Enable and Global Write control
Multiple chip enables for depth expansion:
three chip enables for TA(GVTI)/A(CY) package version
and two chip enables for B(GVTI)/BG(CY) and T(GV-
TI)/AJ(CY) package versions
Address pipeline capability
Address, data and control registers
Internally self-timed Write Cycle
Burst control pins (interleaved or linear burst se-
quence)
Automatic power-down for portable applications
JTAG boundary scan for B and T package version
Low profile 119-bump, 14-mm x 22-mm PBGA (Ball Grid
Array) and 100-pin TQFP packages
and a 2-bit counter for internal burst operation. All synchro-
nous inputs are gated by registers controlled by a posi-
tive-edge-triggered Clock Input (CLK). The synchronous in-
puts include all addresses, all data inputs, address-pipelining
Chip Enable (CE), depth-expansion Chip Enables (CE
2
and
CE
2
), Burst Control Inputs (ADSC, ADSP, and ADV), Write En-
ables (BWa, BWb, BWc, BWd, and BWE), and Global Write
(GW). However, the CE
2
Chip Enable input is only available for
the TA(GVTI)/A(CY) package version.
Asynchronous inputs include the Output Enable (OE) and
Burst Mode Control (MODE). The data outputs (Q), enabled
by OE, are also asynchronous.
Addresses and chip enables are registered with either Ad-
dress Status Processor (ADSP) or Address Status Controller
(ADSC) input pins. Subsequent burst addresses can be inter-
nally generated as controlled by the Burst Advance Pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate self-timed WRITE cycle. WRITE cycles can be one
to four bytes wide as controlled by the write control inputs.
Individual byte write allows individual byte to be written. BWa
controls DQa. BWb controls DQb. BWc controls DQc. BWd
controls DQd. BWa, BWb, BWc, and BWd can be active only
with BWE being LOW. GW being LOW causes all bytes to be
written. The x18 version only has 18 data inputs/outputs (DQa
and DQb) along with BWa and BWb (no BWc, BWd, DQc, and
DQd).
For the B(GVTI)/BG(CY) and T(GVTI)/AJ(CY) package ver-
sions, four pins are used to implement JTAG test capabilities:
Test Mode Select (TMS), Test Data-In (TDI), Test Clock (TCK),
and Test Data-Out (TDO). The JTAG circuitry is used to serially
shift data to and from the device. JTAG inputs use
LVTTL/LVCMOS levels to shift data during this testing mode of
operation. The TA package version does not offer the JTAG
capability.
The
CY7C1366A/GVT71256C36
and
CY7C1367A/
GVT71512C18 operate from a +3.3V power supply. All inputs
and outputs are LVTTL compatible.
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
CY7C1366A-166AC相關(guān)型號PDF文件下載
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16K x 8/9 Dual-Port Static RAM with Sem, Int, Busy
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64K/128K x 8/9 Dual-Port Static RAM
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英文版
64K/128K x 8/9 Dual-Port Static RAM
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英文版
16K x 8/9 Dual-Port Static RAM with Sem, Int, Busy
Cypress
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英文版
32K x 8/9 Dual-Port Static RAM
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英文版
64K/128K x 8/9 Dual-Port Static RAM
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64K/128K x 8/9 Dual-Port Static RAM
CYPRESS [C...
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64K/128K x 8/9 Dual-Port Static RAM
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32K/64K x 16/18 Dual-Port Static RAM
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