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GT28F800B3-T120 Datasheet

  • GT28F800B3-T120

  • SMART 3 ADVANCED BOOT BLOCK WORD-WIDE

  • 426.02KB

  • 49頁

  • INTEL   INTEL

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PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
WORD-WIDE
4-MBIT (256K X 16), 8-MBIT (512K X 16),
16-MBIT (1024K X 16)
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3
Flexible SmartVoltage Technology
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2.7V鈥?.6V Program/Erase
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2.7V鈥?.6V Read Operation
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12V V
PP
Fast Production
Programming
2.7V or 1.8V I/O Option
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Reduces Overall System Power
Optimized Block Sizes
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Eight 4-KW Blocks for Data,
Top or Bottom Locations
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Up to Thirty-One 32-KW Blocks for
Code
High Performance
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2.7V鈥?.6V: 120 ns Max Access Time
Block Locking
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V
CC
-Level Control through WP#
Low Power Consumption
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20 mA Maximum Read Current
Absolute Hardware-Protection
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V
PP
= GND Option
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V
CC
Lockout Voltage
Extended Temperature Operation
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鈥?0擄C to +85擄C
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Supports Code Plus Data Storage
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Optimized for FDI, Flash Data
Integrator Software
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Fast Program Suspend Capability
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Fast Erase Suspend Capability
Extended Cycling Capability
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10,000 Block Erase Cycles
Automated Word Program and Block
Erase
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Command User Interface
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Status Registers
SRAM-Compatible Write Interface
Automatic Power Savings Feature
Reset/Deep Power-Down
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1 碌A I
CC
Typical
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Spurious Write Lockout
Standard Surface Mount Packaging
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48-Ball
碌BGA*
Package
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48-Lead TSOP Package
Footprint Upgradeable
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Upgradeable from 2-, 4- and 8-Mbit
Boot Block
ETOX鈩?V (0.4
碌)
Flash Technology
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The new Smart 3 Advanced Boot Block, manufactured on Intel鈥檚 latest 0.4碌 technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide
products will be available in 48-lead TSOP and 48-ball 碌BGA* packages. Additional information on this
product family can be obtained by accessing Intel鈥檚 WWW page: http://www.intel.com/design/flcomp.
May 1997
Order Number: 290580-002

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