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GT28F320C3BA110 Datasheet

  • GT28F320C3BA110

  • Advanced+ Boot Block Flash Memory (C3)

  • 68頁

  • INTEL   INTEL

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Intel
攏
Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
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Flexible SmartVoltage Technology
鈥?2.7 V鈥?3.6 V Read/Program/Erase
鈥?12 V for Fast Production Programming
1.65 V鈥?.5 V or 2.7 V鈥?.6 V I/O Option
鈥?Reduces Overall System Power
High Performance
鈥?2.7 V鈥?3.6 V: 70 ns Max Access Time
Optimized Architecture for Code Plus
Data Storage
鈥?Eight 4 Kword Blocks, Top or Bottom
Parameter Boot
鈥?Up to One Hundred-Twenty-Seven 32
Kword Blocks
鈥?Fast Program Suspend Capability
鈥?Fast Erase Suspend Capability
Flexible Block Locking
鈥?Lock/Unlock Any Block
鈥?Full Protection on Power-Up
鈥?WP# Pin for Hardware Block Protection
Low Power Consumption
鈥?9 mA Typical Read
鈥?7 A Typical Standby with Automatic
Power Savings Feature (APS)
Extended Temperature Operation
鈥?鈥?0 擄C to +85 擄C
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128-bit Protection Register
鈥?64 bit Unique Device Identifier
鈥?64 bit User Programmable OTP Cells
Extended Cycling Capability
鈥?Minimum 100,000 Block Erase Cycles
Software
鈥?Intel
廬
Flash Data Integrator (FDI)
鈥?Supports Top or Bottom Boot Storage,
Streaming Data (e.g., voice)
鈥?Intel Basic Command Set
鈥?Common Flash Interface (CFI)
Standard Surface Mount Packaging
鈥?48-Ball
碌BGA*/VFBGA
鈥?64-Ball Easy BGA Packages
鈥?48-Lead TSOP Package
ETOX鈩?VIII (0.13
碌m)
Flash
Technology
鈥?16, 32 Mbit
ETOX鈩?VII (0.18
碌m)
Flash Technology
鈥?16, 32, 64 Mbit
ETOX鈩?VI (0.25
碌m)
Flash Technology
鈥?8, 16 and 32 Mbit
The Intel
廬
Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel鈥檚 latest
0.13
碌m
and 0.18
碌m
technologies, represents a feature-rich solution for low-power applications.
The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high-
speed, low-power operation. Flexible block locking allows any block to be independently locked
or unlocked. Add to this the Intel
廬
Flash Data Integrator (FDI) software and you have a cost-
effective, flexible, monolithic code plus data storage solution. Intel
廬
Advanced+ Boot Block Flash
Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA
packages. Additional information on this product family can be obtained by accessing the Intel
廬
Flash website: http://www.intel.com/design/flash.
Notice:
This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
Order Number: 290645-017
October 2003

GT28F320C3BA110 產(chǎn)品屬性

  • 300

  • 集成電路 (IC)

  • 存儲器

  • -

  • 閃存

  • 高級 + 啟動塊閃存

  • 32M（2M x 16）

  • 110ns

  • 并聯(lián)

  • 2.7 V ~ 3.6 V

  • -40°C ~ 85°C

  • 47-MBGA

  • 48-µBGA CSP

  • 托盤

  • 820975

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