GP2W0001YP
IrDA Data Sheet
FEATURES
鈥?Built-in Photodiode
鈥?Operating voltage 2.7 V to 5.5 V
鈥?In circuit design, allow for the degradation of light
emitting diode output that results from long continu-
ous operation (50% degradation/5 years).
鈥?This product shall not contain the following materi-
als, and these materials shall not be used in the pro-
duction process for this product.
鈥?CFCs
鈥?Halon
鈥?Carbon Tetrachloride
鈥?1.1.1. Trichloroethane (Methylchloroform)
鈥?Specific brominated flame retardants such as the
PBBOs and PBBs are not used in this device.
115 kbps Transceiver
designed by considering 0.5 ms or more that is spec-
ified by IrDA. This turn around time means the time
that this device temporarily does not detect the
incoming signal, since the transmitted light from the
transmitter side reaches the detector side of the
same transceiver.
鈥?Consider that 20 ms or more (at T
A
= 25擄C, no input
signal) is necessary to return from shut-down mode
to ready operation mode. In addition, thoroughly
confirm the operation in the actual application.
鈥?When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than the desired signal output may
be generated as noise on the output terminal of the
transceiver. Consider the layout and structure in your
design to minimize disturbing light on the detector face.
鈥?When the sensor is adopted in an IR communication
system, it should be used according to the signal
method specified by 鈥楽erial Infrared Physical Layer
Link Specification鈥?published by the Infrared Data
Association. Faulty operation may occur if a signal
method other than that specified is used.
INTRODUCTION
This specification applies to the outline and charac-
teristics of IrDA 1.2 type (data rate 2.4 kbps to
115.2 kbps, low power option compliant) optical data
communication transceiver.
NOTES
鈥?Caution should be taken to prevent the detector sur-
face from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
鈥?Cleaning conditions:
鈥?Solvent cleaning: Solvent temperature 45擄C or
less. Immersion for 3 minutes or less.
鈥?Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immedi-
ate or potential defects.
鈥?Cleaning solvent: The cleaning shall be carried
out with ethyl alcohol, methyl alcohol, or isopropyl
alcohol.
鈥?In order to prevent electrostatic damage to the inte-
grated circuit, handle this device in a static-free envi-
ronment and workstation.
鈥?External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
鈥?Refer to the 鈥楶recautions for Soldering鈥?section.
鈥?When the system (program) is designed, the turn
around time from transmit to receive should be
1
2
LEDA TXD
R
2
RL
CX
2
3
4
5
SD RXD GND
6
V
CC
CX
1
+
R
1
TX
COMPONENTS
CX
1
CX
2
R
1
R
2
RL
(STANDARD)
RL
(LOW POWER)
SD
RXD
V
CC
RECOMMENDED VALUES
47
碌F/6.3
V (NOTE)
1500 pF/25 V
47
鈩?/div>
鹵5%, 1/10 W (NOTE)
1 k鈩?鹵5%, 1/10 W
2.2
鈩?/div>
鹵5%, 1/2 W
(V
CC
= 3.0 V, I
E
= 40 mW/sr)
33
鈩?/div>
鹵1%, 1/8 W
(V
CC
= 3.0 V, I
E
= 3.6 mW/Sr)
NOTE:
Choose the most suitable CX
1
and R
1
according to
the noise level and noise frequency of power supply.
GP2W0001YP-1
Figure 1. Recommended External Circuit
IrDA Data Sheet
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