鈾?/div>
High temperature soldering guaranteed:
250擄C, 0.16" (4.06mm) from case for 10 seconds
0.113 (2.87)
0.103 (2.62)
0.145 (3.68)
0.135 (3.43)
0.560 (14.22)
0.530 (13.46)
0.410 (10.41)
0.390 (9.91)
PIN
1
0.160 (4.06)
0.140 (3.56)
0.560 (14.22)
0.530 (13.46)
2
0.635 (16.13)
0.625 (15.87)
0.350 (8.89)
0.330 (8.38)
1.148 (29.16)
1.118 (28.40)
0.110 (2.79)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC TO-220AC molded plastic body over
passivated chip
Terminals:
Lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.064 ounce, 1.81 grams
0.105 (2.67)
0.095 (2.41)
0.037 (0.94)
0.027 (0.68)
0.022 (0.56)
0.014 (0.36)
PIN 1
0.205 (5.20)
0.195 (4.95)
PIN 2
CASE
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GI1401
GI1402
GI1403
GI1404
UNITS
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
C
=125擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
C
=125擄C
Maximum instantaneous forward voltage at:
I
F
=4A, T
J
=100擄C
I
F
=8A, T
J
=100擄C
I
F
=4A, T
J
=25擄C
I
F
=8A, T
J
=25擄C
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
(NOTE 4)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
50
35
50
100
70
100
8.0
125.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
Amps
V
F
0.800
0.895
0.900
0.975
5.0
150.0
35.0
85.0
15.0
2.2
-65 to +150
Volts
T
C
=25擄C
T
C
=100擄C
I
R
t
rr
C
J
R
螛JA
R
螛JC
T
J
, T
STG
碌A(chǔ)
ns
pF
擄C/W
擄C
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient in free air, no heatsink
(4) Thermal resistance from junction to case mounted on heatsink
4/98
1
2
