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High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC TO-263AB molded plastic body over
passivated chips
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounce, 2.24 grams
PIN 1
K - HEATSINK
PIN 2
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
FESB
SYMBOLS 16AT
FESB
16BT
FESB
16CT
FESB
16DT
FESB
16FT
FESB FESB
16GT 16HT
FESB
16JT UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
C
=100擄C
Maximum instantaneous forward voltage at 16A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
Typical thermal resistance
Typical junction capacitance
(NOTE 2)
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
150
105
150
200
140
200
300
210
300
400
280
400
500
350
500
600 Volts
420 Volts
600 Volts
Amps
16.0
I
FSM
V
F
I
R
t
rr
C
J
R
螛JC
T
J
, T
STG
35.0
0.975
250.0
1.3
10.0
500.0
50.0
175.0
1.2
-65 to +150
145.0
1.5
Amps
Volts
碌A(chǔ)
ns
pF
擄C/W
擄C
T
C
=25擄C
T
C
=100擄C
(NOTE1)
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to case
4/98
1
2
