鈾?/div>
High temperature soldering guaranteed:
250擄C, 0.16" (4.06mm) from case for 10 seconds
0.113 (2.87)
0.103 (2.62)
0.145 (3.68)
0.135 (3.43)
0.560 (14.22)
0.530 (13.46)
0.410 (10.41)
0.390 (9.91)
PIN
1
0.160 (4.06)
0.140 (3.56)
0.560 (14.22)
0.530 (13.46)
2
0.635 (16.13)
0.625 (15.87)
0.350 (8.89)
0.330 (8.38)
1.148 (29.16)
1.118 (28.40)
0.110 (2.79)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC TO-220AC molded plastic body over
passivated chips
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.064 ounce, 1.81 grams
0.105 (2.67)
0.095 (2.41)
0.037 (0.94)
0.027 (0.68)
0.022 (0.56)
0.014 (0.36)
PIN 1
0.205 (5.20)
0.195 (4.95)
PIN 2
CASE
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
FES
SYMBOLS 16AT
FES
16BT
FES
16CT
FES
16DT
FES
16FT
FES
16GT
FES
16HT
FES
16JT UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
C
=100擄C
Maximum instantaneous forward voltage at 16A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
Typical thermal resistance
Typical junction capacitance
(NOTE 2)
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
150
105
150
200
140
200
300
210
300
400
280
400
500
350
500
600 Volts
420 Volts
600 Volts
Amps
16.0
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
R
螛JC
T
J
, T
STG
35.0
0.975
250.0
1.3
10.0
500.0
50.0
175.0
16.0
1.2
-65 to +150
145.0
1.5
Amps
Volts
碌A(chǔ)
ns
pF
擄C/W
擄C
T
C
=25擄C
T
C
=100擄C
(NOTE1)
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to case and ambient mounted on heatsink
4/98
1
2
