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High temperature soldering guaranteed:
250擄C, 0.25" (6.35mm) from case for 10 seconds
0.405 (10.27)
0.383 (9.72)
0.188 (4.77)
0.172 (4.36)
0.110 (2.80)
0.100 (2.54)
0.140 (3.56)
DIA.
0.130 (3.30)
0.131 (3.39)
DIA.
0.122 (3.08)
0.600 (15.5)
0.580 (14.5)
PIN
1
2
3
0.670 (17.2)
0.646 (16.4)
0.350 (8.89)
0.330 (8.38)
0.191 (4.85)
0.171 (4.35)
0.560 (14.22)
0.530 (13.46)
0.060 (1.52)
0.110 (2.80)
0.100 (2.54)
MECHANICAL DATA
0.037 (0.94)
0.027 (0.69)
0.105 (2.67)
0.095 (2.41)
0.022 (0.55)
0.014 (0.36)
PIN 1
PIN 3
PIN 2
0.205 (5.20)
0.195 (4.95)
Dimensions in inches and (millimeters)
Case:
JEDEC ITO-220AB molded plastic body over
passivated chips
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounce, 2.24 grams
Mounting Torque:
5 in. - lb. max.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
FEPF6AT
FEPF6BT
FEPF6CT
FEPF6DT
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage
per leg at 3.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical thermal resistance
(NOTE 2)
Typical junction capacitance per leg
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
6.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
I
FSM
100.0
Amps
V
F
I
R
t
rr
R
螛JC
C
J
T
J,
T
STG
0.975
5.0
50.0
35.0
5.4
28.0
-55 to +150
Volts
碌A(chǔ)
ns
擄C/W
pF
擄C
T
A
=25擄C
T
A
=100擄C
Maximum reverse recovery time per leg
(NOTE 1)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
r
=1.0A, I
rr
=0.25A
(2) Thermal resistance from junction to case per leg mounted on heatsink
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
4/98
1
2
