鈾?/div>
High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
PIN 1
K - HEATSINK
PIN 2
Dimensions are in inches and (millimeters)
Case:
JEDEC TO-263AB molded plastic body
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounce, 2.24 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
FEPB6AT
FEPB6BT
FEPB6CT
FEPB6DT
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage
per leg at 3.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical thermal resistance
(NOTE 2)
Typical junction capacitance per leg
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
6.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
I
FSM
100.0
Amps
V
F
I
R
t
rr
R
螛JC
C
J
T
J,
T
STG
0.975
5.0
50.0
35.0
3.6
28.0
-55 to +150
Volts
碌A(chǔ)
ns
擄C/W
pF
擄C
T
C
=25擄C
T
C
=100擄C
Maximum reverse recovery time per leg
(NOTE 1)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
r
=1.0A, I
rr
=0.25A
(2) Thermal resistance from junction to case per leg mounted on heatsink
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
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1
2
