鈾?/div>
High temperature soldering guaranteed:
250擄C, 0.16鈥?(4.06mm) from case for 10 seconds
0.170
(4.3)
0.840 (21.3)
0.820 (20.8)
10
o
TYP.
BOTH SIDES
0.142 (3.6)
0.138 (3.5)
1
2
3
0.086 (2.18)
0.076 (1.93)
1
o
REF.
BOTH SIDES
0.118 (3.0)
0.108 (2.7)
0.127 (3.22)
0.160 (4.1)
0.140 (3.5)
0.795 (20.2)
0.775 (19.6)
0.117 (2.97)
MECHANICAL DATA
0.048 (1.22)
0.225 (5.7)
0.205 (5.2)
0.044 (1.12)
0.030 (0.76)
0.020 (0.51)
PIN 2
CASE
PIN 1
PIN 3
Dimensions in inches and (millimeters)
Case:
JEDEC TO-247AD molded plastic body over
passivated chips
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Mounting Torque:
10 in. - lbs. max.
Weight:
0.22 ounce, 6.3 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
FEP
30AP
FEP
30BP
FEP
30CP
FEP
30DP
FEP
30FP
FEP
30GP
FEP
30HP
FEP
30JP
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
C
=100擄C
Maximum instantaneous forward voltage per leg
at 15.0A
Maximum DC reverse current
at rated DC blocking voltage
T
C
=25擄C
T
C
=100擄C
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
150
105
150
200
140
200
300
210
300
30.0
400
280
400
500
350
500
600
420
600
Volts
Volts
Volts
Amps
I
FSM
300.0
Amps
V
F
I
R
t
rr
C
J
R
螛JC
T
J
, T
STG
0.95
10.0
500.0
35.0
175.0
1.0
1.3
1.5
Volts
碌A(chǔ)
Maximum reverse recovery time time
(NOTE 1)
per leg
Typical junction capacitance per leg
Typical thermal resistance
(NOTE 3
)
Operating storage and temperature range
(NOTE 2
)
50.0
145.0
ns
pF
擄C/W
擄C
-55 to +150
NOTES:
1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to case per leg mounted on heatsink
4/98
1
2
