鈩?/div>
@ V
GS
= -2.5 V.
Low gate charge (3.6 nC typical).
High performance trench technology for extremely low
R
DS(ON)
.
High power version of industry standard SOT-23 package.
Identical pin out to SOT-23 with 30% higher power handling
capability.
SOT-23
SuperSOT -6
TM
SuperSOT
TM
-8
SO-8
SOT-223
SOIC-16
D
D
6
33
S
SuperSOT -3
TM
G
G
S
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
,T
STG
R
胃
JA
R
胃
JC
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current
T
A
= 25
o
C unless other wise noted
FDN336P
-20
鹵8
Units
V
V
A
- Continuous
- Pulsed
-1.3
-10
(Note 1a)
(Note 1b)
Maximum Power Dissipation
0.5
0.46
-55 to +150
W
Operating and Storage Temperature Range
擄C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
250
75
擄C/W
擄C/W
漏 1998 Fairchild Semiconductor Corporation
FDN336P Rev.C