CHIPDATEN / DIE DATA
(Mechanisch-technische Kenndaten / mechanical-technical characteristic data)
E113x R
Chips for relative 3x3mm Pressure Sensor
Diameter of Wafer
Die Size
Metallization Frontside
Passivation
Chip Backside
Die Thickness
Dicing
Pad Size in Diameter
Pad Pitch
Maximum Diameter of Rear Hole
150mm / 6鈥?/div>
3 mm x 3 mm
Aluminum
Oxide / CVD Nitride / Plasma Nitride / EPOS
Silicon
850 鹵 100 碌m
Sawing
200 碌m
500 碌m
1,2 mm (typ. 0,9 mm)
Sectional View:
(not to scale)
oxide, CVD nitride
epitaxial layer /
piezo resistors
systemchip
AuSi - alloy
constraint
chip
plasma nitride
EPOS Metallization
Front Side:
V
in
+
V
out
+
Substrate
Substrate
V
out
-
V
in
-
V
out
-
V
in
+
8/99
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