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DPS256X16CI3-35M Datasheet

  • DPS256X16CI3-35M

  • x16 SRAM Module

  • 10頁

  • ETC

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4 Megabit High Speed CMOS SRAM
DPS256X16Cn3/DPS256X16Bn3
DESCRIPTION:
The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM 鈥樷€橲TACK鈥欌€?/div>
modules are a revolutionary new memory subsystem using Dense-Pac
Microsystems鈥?ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, 鈥樷€橨鈥欌€?leaded or gullwing leaded packages,
or mounted on a 50-pin PGA co-fired ceramic substrate. The module
packs 4-Megabits of low-power CMOS static RAM in an area as small
as 0.463 in
2
, while maintaining a total height as low as 0.349 inches.
The DPS256X16Cn3/DPS256X16Bn3 STACK modules contain four
individual 128K x 8 SRAMs, each packaged in a hermetically sealed
SLCC, making the modules suitable for commercial, industrial and
military applications.
The DPS256X16Bn3 has one active low Chip Enable (CE) and while
the DPS256X16Cn3 an active low Chip Enable (CE) and an active high
Select Line (SEL).
By using SLCCs, the 鈥樷€橲tack鈥欌€?family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
SLCC Stack
Straight Leaded
Stack
FEATURES:
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Organizations Available: 256Kx16 or 512Kx8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation - No clock or refresh required
Single +5V Power Supply,
鹵
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage: 2.0V min.
Packages Available:
48 - Pin SLCC Stack
48 - Pin Straight Leaded Stack
48 - Pin 鈥樷€橨鈥欌€?Leaded Stack
48 - Pin Gullwing Leaded Stack
50 - Pin PGA Dense-Stack
鈥樷€橨鈥欌€?Leaded
Stack
*
Commercial only.
Dense-Stack
Gullwing
Leaded Stack
30A097-34
REV. G
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
1
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