16 Megabit High Speed CMOS SRAM
DPS1MX16MKn3
SLCC Stack
DESCRIPTION:
The DPS1MX16MKn3 High Speed SRAM 鈥樷€橲TACK鈥欌€?modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems鈥?ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, 鈥樷€橨鈥欌€?leaded or gullwing leaded
packages. The module packs 16-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in
2
, while maintaining a
total height as low as 0.269 inches.
The DPS1MX16MKn3 STACK modules contain four individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and
military applications.
By using SLCCs, the 鈥樷€橲tack鈥欌€?family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
Straight
Leaded
Stack
FEATURES:
鈥?/div>
Organizations Available:
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1Meg x 16 or 2 Meg x 8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Single +5V Power Supply,
鹵
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage:
2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
鈥樷€橨鈥欌€?Leaded Stack
Gullwing Leaded Stack
鈥樷€橨鈥欌€?Leaded
Stack
Gullwing
Leaded
Stack
*
Commercial and Industrial Grade only.
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A18
I/O0 - I/O15
CE0 - CE3
WE
OE0, OE1
V
DD
V
SS
N.C.
30A129-04
REV. E
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
Address Inputs
Data Input/Output
Low Chip Enables
Write Enable
Output Enables
Power (+5V)
Ground
No Connect
1
This Material Copyrighted By Its Respective Manufacturer
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