SPICE MODEL: DMMT5401
Lead-free Green
DMMT5401
MATCHED PNP SMALL SIGNAL SURFACE MOUNT
TRANSISTOR
Features
路
路
路
路
路
路
路
Epitaxial Planar Die Construction
Complementary NPN Type Available (DMMT5551)
Ideal for Low Power Amplification and Switching
Intrinsically Matched PNP Pair (Note 1)
2% Matched Tolerance, h
FE
, V
CE(SAT)
, V
BE(SAT)
Lead Free/RoHS Compliant (Note 4)
"Green" Device, Note 5 and 6
H
K
M
C
1
B
1
B
2
E
1
A
E
2
C
2
SOT-26
Dim
B C
Min
0.35
1.50
2.70
戮
戮
2.90
1.00
0.35
0.10
0擄
Max
0.50
1.70
3.00
戮
戮
3.10
1.30
0.55
0.20
8擄
Typ
0.38
1.60
2.80
0.95
0.55
3.00
0.05
1.10
0.40
0.15
戮
A
B
C
D
F
H
J
K
L
M
Mechanical Data
路
路
路
路
路
路
路
路
路
Case: SOT-26
Case Material: Molded Plastic, "Green" Molding
Compound, Note 7. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
Marking (See Page 2): K4S
Order & Date Code Information: See Page 2
Weight: 0.006 grams (approximate)
@ T
A
= 25擄C unless otherwise specified
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
d
R
qJA
T
j
, T
STG
Value
-160
-150
-5.0
-200
300
417
-55 to +150
C
1
B
1
B
2
J
D
F
L
0.013 0.10
E
1
E
2
C
2
a
All Dimensions in mm
Maximum Ratings
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Characteristic
Unit
V
V
V
mA
mW
擄C/W
擄C
Collector Current - Continuous (Note 2)
Power Dissipation (Note 2, 3)
Thermal Resistance, Junction to Ambient (Note 2)
Operating and Storage and Temperature Range
Notes:
1. Built with adjacent die from a single wafer.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Maximum combined dissipation.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30437 Rev. 5 - 2
1 of 4
www.diodes.com
DMMT5401
茫
Diodes Incorporated
1
2
3
4
