0.8MIN.
鍚屽娉?/div>
0.15
錛?.06
(3)
錛?.1
Features
1) Small mold type. (SMD3)
2) High reliability
2.8鹵0.2
1.6
錛?.1
錛?.2
0.95
1.9
0錕?frac12;錕?.1
0.3錕?frac12;錕?.6
SMD3
(2)
0.95
0.95
1.9鹵0.2
(1)
0.8鹵0.1
1.1鹵0.2
0.01
Structure
Construction
Silicon epitaxial planar
ROHM : SMD3
JEDEC :S0T-346
JEITA : SC-59
week code
Taping specifications
(Unit : mm)
4.0鹵0.1
2.0鹵0.05
蠁1.5鹵0.1
銆€銆€銆€銆€銆€ 0
1.75鹵0.1
0.3鹵0.1
3.5鹵0.05
8.0鹵0.2
3.2鹵0.1
3.2鹵0.1
4.0鹵0.1
蠁1.05MIN
0錕?frac12;錕?.5
5.5鹵0.2
3.2鹵0.1
1.35鹵0.1
Absolute maximum ratings
(Ta=25擄C)
Parameter
Reverse voltage (repatitive peak)
Reverse voltage (DC)
Forward current (Single)
Forward current (Double)
Average rectified forward current (Single)
Average rectified forward current (double)
Surge current
錛坱=1us錛?/div>
(Single)
Surge current
錛坱=1us錛?錛圖ouble錛?/div>
Power dissipation
Junction temperature
Storage temperature
Symbol
V
RM
V
R
I
FM
I
FM
Io
Io
I
surge
I
surge
Pd
Tj
Tstg
Limits
80
80
300
450
100
150
4
6
200
150
-55 to +150
Unit
V
V
mA
mA
mA
mA
A
A
mW
鈩?/div>
鈩?/div>
Electrical characteristics
(Ta=25擄C)
Parameter
Forward voltage
Reverse current
Capacitance between terminals
Reverse recovery time
Symbol
V
F
I
R
Ct
trr
Min.
-
-
-
-
Typ.
-
-
-
-
Max.
1.2
0.2
3.5
4
Unit
V
碌A(chǔ)
pF
ns
Conditions
I
F
=100mA
V
R
=70V
V
R
=0.5V , f=1MHz
V
R
=6V , IF=5mA , RL=50惟
Rev.A
2.4
0.4
錛?.1
銆€錛?.05
1.0MIN.
1/2
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