鈥?/div>
鈥?Supports concurrent transactions
300 MHz to 375 MHz clock for high bandwidth
4-Word Burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write
ports (data transferred at 750 MHz) at 375 MHz
Read latency of 2.0 clock cycles
Two input clocks (K and K) for precise DDR timing
鈥?SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate Port Selects for depth expansion
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency providing most current data
Core V
DD
= 1.8V 鹵 0.1V; IO V
DDQ
= 1.4V to V
DD[1]
HSTL inputs and Variable drive HSTL output buffers
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Functional Description
The CY7C1241V18, CY7C1256V18, CY7C1243V18, and
CY7C1245V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with Quad Data Rate-II+ (QDR-II+) architecture.
QDR-II+ architecture consists of two separate ports to access
the memory array. The read port has dedicated data outputs
to support read operations and the write port has dedicated
data inputs to support write operations. QDR-II+ architecture
has separate data inputs and data outputs to completely
eliminate the need to 鈥渢urn around鈥?the data bus required with
common IO devices. Each port can be accessed through a
common address bus. Read and write addresses are latched
on alternate rising edges of the input (K) clock. Accesses to
the QDR-II+ read and write ports are completely independent
of one another. To maximize data throughput, both read and
write ports are equipped with Double Data Rate (DDR) inter-
faces. Each address location is associated with four 8-bit
words (CY7C1241V18), 9-bit words (CY7C1256V18), 18-bit
words (CY7C1243V18), or 36-bit words (CY7C1245V18), that
burst sequentially into or out of the device. Because data can
be transferred into and out of the device on every rising edge
of both input clocks (K and K), memory bandwidth is
maximized while simplifying system design by eliminating bus
鈥渢urn-arounds鈥?
Depth expansion is accomplished with Port Selects for each
port. Port selects enable each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Configurations
With Read Cycle Latency of 2.0 cycles:
CY7C1241V18 鈥?4M x 8
CY7C1256V18 鈥?4M x 9
CY7C1243V18 鈥?2M x 18
CY7C1245V18 鈥?1M x 36
Selection Guide
375 MHz
Maximum Operating Frequency
Maximum Operating Current
375
1240
333 MHz
333
1120
300 MHz
300
1040
Unit
MHz
mA
Note
1. The QDR consortium specification for V
DDQ
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting
V
DDQ
= 1.4V to V
DD
.
Cypress Semiconductor Corporation
Document Number: 001-06365 Rev. *C
鈥?/div>
198 Champion Court
鈥?/div>
San Jose
,
CA 95134-1709
鈥?/div>
408-943-2600
Revised May 11, 2007
[+] Feedback
next