MCC
Features
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omponents
21201 Itasca Street Chatsworth
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BZT52C2V4
THRU
BZT52C39
410 mW
Zener Diodes
2.4 to 39 Volts
Planar Die construction
410mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
Mechanical Data
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Case:
SOD-123 Molded Plastic
SOD123
A
B
C
E
Terminals: Solderable per MIL-STD-202, Method 208
Approx. Weight: 0.008 gram
Mounting Position: Any
Storage & Operating Junction Temperature: -55 C to +150 C
o
o
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Zener Current
I
F
100
mA
Maximum Forward
V
F
1.2
V
Voltage
Power Dissipation
P
(AV)
410
mWatt
(No te s A)
Peak Forward S urge
I
FSM
2.0
Amps
Current (Not e s B)
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or equivalent
square wave, duty cycle = 4 pulses per minute maximum
.
H
D
J
G
DIM
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.140
.152
3.55
3.85
.100
.112
2.55
2.85
.055
.071
1.40
1.80
-----
.053
-----
1.35
.012
.031
0.30
.78
.006
-----
0.15
-----
-----
.01
-----
.25
-----
.006
-----
.15
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.093"
0.048鈥?/div>
0.036鈥?/div>
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