鈾?/div>
High temperature soldering guaranteed:
250擄C, 0.25" (6.35mm) from case for 10 seconds
0.405 (10.27)
0.383 (9.72)
0.188 (4.77)
0.172 (4.36)
0.110 (2.80)
0.100 (2.54)
0.140 (3.56)
DIA.
0.130 (3.30)
0.131 (3.39)
DIA.
0.122 (3.08)
0.600 (15.5)
0.580 (14.5)
0.676 (17.2)
0.646 (16.4)
2
0.350 (8.89)
0.330 (8.38)
PIN
1
0.191 (4.85)
0.171 (4.35)
0.560 (14.22)
0.530 (13.46)
0.060 (1.52)
0.110 (2.80)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC ITO-220AC fully overmolded plastic body
over passivated chip
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.064 ounce, 1.81 grams
Mounting Torque:
5 in. - lbs. max.
0.037 (0.94)
0.027 (0.69)
0.205 (5.20)
0.195 (4.95)
PIN 1
PIN 2
0.022 (0.55)
0.014 (0.36)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
BY229X
-200
BY229X
-400
BY229X
-600
BY229X
-800
UNITS
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 20A
Maximum DC reverse current
at rated DC blocking voltage
Maximum recovered stored charge
Maximum thermal resistance
T
J
=25擄C
at T
J
=125擄C
V
RRM
V
RMS
V
DC
I
(AV)
200
140
200
400
280
400
8.0
600
420
600
800
560
800
Volts
Volts
Volts
Amps
I
FSM
V
F
I
R
t
rr
Q
rr
dir/dt
R
螛JC
R
螛JA
T
J
, T
STG
V
ISOL
100
1.85
10.0
300
145
700
60
4.8
20
-40 to +150
4500
(NOTE 4)
3500
(NOTE 5)
1500
(NOTE 6)
Amps
Volts
碌A(chǔ)
ns
nC
A/碌s
擄C/W
擄C/W
擄C
Volts
Maximum reverse recovery time
(NOTE 1)
(NOTE 2)
Maximum slope of reverse recovery current
(NOTE 2)
(NOTE 3)
Typical thermal resistance, junction to air
Operating junction and storage temperature range
RMS Isolation voltage from terminals to heatsink
with RH
鈮?/div>
30%
NOTES:
(1) Reverse recovery test conditions: I
F
=1A, V
R
=30V, di/dt=50A/碌s, I
rr
=10% I
RM
(2) Q
rr
test conditions: I
F
=2A, V
R
=30V, di/dt=20A/碌s
(3) Thermal resistance from junction to case mounted on heatsink with heatsink compound
(4) Clip mounting, where lead does not overlap heatsink with 0.110鈥?offset.
(5) Clip mounting, where leads do overlap heatsink.
(6) Screw mounting, where washer diameter is
鈮?/div>
4.9 mm (0.19鈥?.
10/12/98
1
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