OPTOELECTRONICS CORP.
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Feature:
1. High brightness surface mount LED.
2. Based on GaN technology.
3. 120擄 viewing angle.
4. Small package outline (LxWxH) of 2.8 x 3.2 x 1.8 mm.
5. Qualified according to JEDEC moisture sensitivity Level 2.
6. Compatible to both IR reflow soldering and TTW soldering.
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Package Dimension:
Solder Pad Design
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