鈥?/div>
Pb鈭扚ree Packages are Available*
http://onsemi.com
COLLECTOR
2
3
BASE
3
BASE
NPN
Symbol
V
CEO
V
CES
V
EBO
I
C
P
D
Value
20
25
5.0
1.0
625
5.0
P
D
1.5
12
T
J
, T
stg
鈭?5 to
+150
Unit
Vdc
Vdc
Vdc
Adc
mW
mW/擄C
Watt
mW/擄C
擄C
BC36x = Specific Device Code
x
= 8 or 9
Y
= Year
WW = Work Week
1
2
3
CASE 29
TO鈭?2
STYLE 14
1
EMITTER
PNP
1
EMITTER
COLLECTOR
2
MAXIMUM RATINGS
Rating
Collector 鈭扙mitter Voltage
Collector 鈭扙mitter Voltage
Emitter 鈭払ase Voltage
Collector Current 鈭?Continuous
Total Device Dissipation
@ T
A
= 25擄C
Derate above 25擄C
Total Device Dissipation
@ T
C
= 25擄C
Derate above 25擄C
Operating and Storage Junction
Temperature Range
MARKING
DIAGRAM
BC
36x
YWW
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
ORDERING INFORMATION
Device
Package
TO鈭?2
TO鈭?2
TO鈭?2
(Pb鈭扚ree)
TO鈭?2
TO鈭?2
TO鈭?2
(Pb鈭扚ree)
Shipping
鈥?/div>
5000 Units/Box
2000/Ammo Pack
2000/Ammo Pack
5000 Units/Box
2000/Ammo Pack
2000/Ammo Pack
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction鈭抰o鈭扐mbient
Thermal Resistance,
Junction鈭抰o鈭扖ase
Symbol
R
qJA
R
qJC
Max
200
83.3
Unit
擄C/W
擄C/W
BC368
BC368ZL1
BC368ZL1G
BC369
BC369ZL1
BC369ZL1G
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
漏
Semiconductor Components Industries, LLC, 2004
1
May, 2004 鈭?Rev. 4
Publication Order Number:
BC368/D
1
2
3
4
