74LVT574 鈥?74LVTH574 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
March 1999
Revised November 2000
74LVT574 鈥?74LVTH574
Low Voltage Octal D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT574 and LVTH574 are high-speed, low-power
octal D-type flip-flop featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented appli-
cations. A buffered Clock (CP) and Output Enable (OE) are
common to all flip-flops.
The LVTH574 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These octal flip-flops are designed for low-voltage (3.3V)
V
CC
applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT574 and LVTH574
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH574),
also available without bushold feature (74LVT574).
s
Live insertion/extraction permitted
s
Power Up/Down high impedance provides glitch-free
bus loading
s
Outputs source/sink
鈭?/div>
32 mA/
+
64 mA
s
Functionally compatible with the 74 series 574
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
>
2000V
Machine model
>
200V
Charged-device model
>
1000V
Ordering Code:
Order Number
74LVT574WM
74LVT574SJ
74LVT574MSA
74LVT574MTC
74LVTH574WM
74LVTH574SJ
74LVTH574MSA
74LVTH574MTC
Package Number
M20B
M20D
MSA20
MTC20
M20B
M20D
MSA20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Logic Symbols
IEEE/IEC
漏 2000 Fairchild Semiconductor Corporation
DS012451
www.fairchildsemi.com
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