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74LVTH2240MTC Datasheet

  • 74LVTH2240MTC

  • Low Voltage Inverting Octal Buffer/Line Driver with 3-STATE ...

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  • FAIRCHILD

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74LVT2240 鈥?74LVTH2240 Low Voltage Inverting Octal Buffer/Line Driver with 3-STATE Outputs
July 1999
Revised August 1999
74LVT2240 鈥?74LVTH2240
Low Voltage Inverting Octal Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT2240 and LVTH2240 are inverting octal buffers
and line drivers designed to be employed as memory
address drivers, clock drivers and bus oriented transmitters
or receivers which provides improved PC board density.
The equivalent 25鈩?Series resistors helps reduce output
overshoot and undershoot.
The LVTH2240 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These inverting octal buffers and line drivers are designed
for low-voltage (3.3V) V
CC
applications, but with the capa-
bility to provide a TTL interface to a 5V environment. The
LVT2240 and LVTH2240 are fabricated with an advanced
BiCMOS technology to achieve high speed operation simi-
lar to 5V ABT while maintaining low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Equivalent 25鈩?Series resistors on outputs
s
Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs (74LVTH2240), also
available without bushold feature (74LVT2240).
s
Live insertion/extraction permitted
s
Power Up/Down high impedance provides glitch-free
bus loading
s
Outputs source/sink
鈭?2
mA/+12 mA
s
Latch-up performance exceeds 500 mA
Ordering Code:
Order Number
74LVT2240WM
74LVT2240SJ
74LVT2240MTC
74LVTH2240WM
74LVTH2240SJ
74LVTH2240MTC
Package Number
M20B
M20D
MTC20
M20B
M20D
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Logic Symbol
IEEE/IEC
Connection Diagram
漏 1999 Fairchild Semiconductor Corporation
DS500212
www.fairchildsemi.com

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