12 mA.
鈭?/div>
32 mA/
+
64 mA
s
Functionally compatible with the 74 series 162245
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
>
2000V
Machine model
>
200V
Charged-device model
>
1000V
s
Also packaged in plastic Fine Pitch Ball Grid Array
(FBGA)
Ordering Code:
Order Number
74LVT162245GX
(Note 1)
74LVT162245MEA
74LVT162245MEAX
74LVT162245MTD
74LVT162245MTDX
74LVTH162245GX
(Note 1)
74LVTH162245MEA
74LVTH162245MEX
74LVTH162245MTD
74LVTH162245MTX
Package Number
BGA54A
(Preliminary)
MS48A
MS48A
MTD48
MTD48
BGA54A
MS48A
MS48A
MTD48
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBE]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBE]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBE]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBE]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Note 1:
BGA package available in Tape and Reel only.
漏 2001 Fairchild Semiconductor Corporation
DS012446
www.fairchildsemi.com