transmitter/receiver. The device is nibble controlled. Indi-
8-bit or 16-bit operation.
鈩?/div>
series resistance in both the HIGH and
LOW states of the output. This design reduces line noise in
applications such as memory address drivers, clock driv-
ers, and bus transceivers/transmitters.
The LVTH162240 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These inverting buffers and line drivers are designed for
low-voltage (3.3V) V
CC
applications, but with the capability
to provide a TTL interface to a 5V environment. The
LVT162240 and LVTH162240 are fabricated with an
advanced BiCMOS technology to achieve high speed oper-
ation similar to 5V ABT while maintaining a low power dis-
sipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Outputs include equivalent series resistance of 25
鈩?/div>
to
make external termination resistors unnecessary and
reduce overshoot and undershoot
s
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH162240),
also available without bushold feature (74LVT162240).
s
Live insertion/extraction permitted
s
Power Up/Down high impedance provides glitch-free
bus loading
s
Functionally compatible with the 74 series 162240
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
>
2000V
Machine model
>
200V
Charged-device model
>
1000V
Ordering Code:
Order Number
74LVT162240MEA
(Note 1)
74LVT162240MTD
(Note 1)
74LVTH162240MEA
74LVTH162240MEX
(Note 2)
74LVTH162240MTD
74LVTH162240MTX
(Note 2)
Package Number
MS48A
MTD48
MS48A
MS48A
MTD48
MTD48
Package Description
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
[TUBE]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBE]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Note 1:
Device also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Note 2:
Use this Order Number to receive devices in Tape and Reel.
漏 2000 Fairchild Semiconductor Corporation
DS012490
www.fairchildsemi.com
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