output helps reduce output overshoot and undershoot.
ing CMOS low power dissipation.
鈩?/div>
series resistors on output
s
Bushold on inputs eliminates the need for external
pull-up/pull-down resistors
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74LCXH162374GX
(Note 1)
74LCXH162374MEA
74LCXH162374MEX
(Note 2)
74LCXH162374MTD
74LCXH162374MTX
(Note 2)
Package
Number
BGA54A
(Preliminary)
MS48A
MS48A
MTD48
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBES]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBES]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Note 1:
BGA package available in Tape and Reel only.
Note 2:
Use this order number to receive devices in Tape and Reel.
Logic Symbol
GTO錚?is a trademark of Fairchild Semiconductor Corporation.
漏 2001 Fairchild Semiconductor Corporation
DS500446
www.fairchildsemi.com