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74LCXH162374MTDX Datasheet

  • 74LCXH162374MTDX

  • 16-Bit D-Type Flip-Flop

  • 11頁(yè)

  • ETC

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74LCXH162374 Low Voltage 16-Bit D-Type Flip-Flop with Bushold and 26鈩?Series Resistors in B Outputs
February 2001
Revised August 2001
74LCXH162374
Low Voltage 16-Bit D-Type Flip-Flop with Bushold
and 26
鈩?/div>
Series Resistors in B Outputs
General Description
The LCXH162374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
The LCXH162374 is designed for low voltage (2.5V or
3.3V) V
CC
applications with capability of interfacing to a 5V
signal environment. The LCXH162374 data inputs include
active bushold circuitry, eliminating the need for external
pull-up resistors to hold unused or floating data inputs at a
valid logic level. The 26
鈩?/div>
series resistor in the output helps
reduce output overshoot and undershoot.
The LCXH162374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
I
5V tolerant control inputs and outputs
I
2.3V鈥?.6V V
CC
specifications provided
I
7.0 ns t
PD
max (V
CC
=
3.3V), 20
碌
A I
CC
max
I
Power down high impedance inputs and outputs
I
鹵
12 mA output drive (V
CC
=
3.0V)
I
Implements patented noise/EMI reduction circuitry
I
Latch-up performance exceeds 500 mA
I
ESD performance:
Human body model
>
2000V
Machine model
>
200V
I
Equivalent 26
鈩?/div>
series resistors on output
I
Bushold on inputs eliminates the need for external
pull-up/pull-down resistors
I
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74LCXH162374GX
(Note 1)
74LCXH162374MEA
(Note 2)
74LCXH162374MTD
(Note 2)
Package
Number
BGA54A
(Preliminary)
MS48A
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1:
BGA package available in Tape and Reel only.
Note 2:
Devices also available in Tape and Reel. Specify by appending the suffix letter 鈥淴鈥?to the ordering code.
Logic Symbol
漏 2001 Fairchild Semiconductor Corporation
DS500446
www.fairchildsemi.com

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