help reduce output overshoot and undershoot.
CMOS low power dissipation.
鈩?/div>
-series resistors in the outputs
s
Supports live insertion/withdrawal (Note 1)
s
鹵
12 mA output drive (V
CC
=
3.0V)
s
Implements patented noise/EMI reduction circuitry
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human body model
>
2000V
Machine model
>
200V
Note 1:
To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
74LCX2244WM
74LCX2244SJ
74LCX2244MSA
74LCX2244MTC
Package Number
M20B
M20D
MSA20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Logic Symbol
IEEE/IEC
Connection Diagram
漏 2001 Fairchild Semiconductor Corporation
DS012569
www.fairchildsemi.com