reduce output overshoot and undershoot.
ing CMOS low power dissipation.
鈩?/div>
series resistor outputs
I
6.2 ns t
PD
max (V
CC
=
3.3V), 20
碌
A I
CC
max
I
Power down high impedance inputs and outputs
I
Supports live insertion/withdrawal (Note 1)
I
鹵
12 mA output drive (V
CC
=
3.0V)
I
Implements patented noise/EMI reduction circuitry
I
Latch-up performance exceeds 500 mA
I
ESD performance:
Human body model
>
2000V
Machine model
>
200V
I
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1:
To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
74LCX162373GX
(Note 2)
74LCX162373MEA
(Note 3)
74LCX162373MTD
(Note 3)
Package Number
BGA54A
(Preliminary)
MS48A
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 2:
BGA package available in Tape and Reel only.
Note 3:
Devices also available in Tape and Reel. Specify by appending the suffix letter 鈥淴鈥?to the ordering code.
Logic Symbol
漏 2001 Fairchild Semiconductor Corporation
DS500443
www.fairchildsemi.com