鈥?/div>
Demultiplexing Capability
Multiple Input Enable for Easy Expansion
Typical Power Dissipation of 32 mW
Active Low Mutually Exclusive Outputs
Input Clamp Diodes Limit High Speed Termination Effects
CONNECTION DIAGRAM DIP
(TOP VIEW)
VCC
16
O0
15
O1
14
O2
13
O3
12
O4
11
O5
10
O6
9
NOTE:
The Flatpak version
has the same pinouts
(Connection Diagram) as
the Dual In-Line Package.
16
1
J SUFFIX
CERAMIC
CASE 620-09
16
1
N SUFFIX
PLASTIC
CASE 648-08
1
A0
2
A1
3
A2
4
E1
5
E2
6
E3
7
O7
8
GND
PIN NAMES
A0 鈥?A2
E1, E2
E3
O0 鈥?O7
Address Inputs
Enable (Active LOW) Inputs
Enable (Active HIGH) Input
Active LOW Outputs (Note b)
LOADING
(Note a)
HIGH
0.5 U.L.
0.5 U.L.
0.5 U.L.
10 U.L.
LOW
0.25 U.L.
0.25 U.L.
0.25 U.L.
5 (2.5) U.L.
16
1
D SUFFIX
SOIC
CASE 751B-03
ORDERING INFORMATION
SN54LSXXXJ
SN74LSXXXN
SN74LSXXXD
Ceramic
Plastic
SOIC
NOTES:
a) 1 TTL Unit Load (U.L.) = 40
碌A(chǔ)
HIGH/1.6 mA LOW.
b) The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74)
Temperature Ranges.
LOGIC DIAGRAM
A2
3
2
A1
1
A0
4
E1 E2 E3
5
6
LOGIC SYMBOL
VCC = PIN 16
GND = PIN 8
= PIN NUMBERS
1 2 3
456
12 3
A0 A1 A2
E
O0 O1 O2 O3 O4 O5 O6 O7
15 14 13 12 11 10 9
VCC = PIN 16
GND = PIN 8
7
9
10
11
12
13
14
15
7
O7
O6
O5
O4
O3
O2
O1
O0
FAST AND LS TTL DATA
5-230