鈥?/div>
Small Size
鈥?Low Noise Figure
6 dB Typical at 9 GHz
鈥?Rugged Design
鈥?High Uniformity
鈥?High Burnout Rating
1 W RF Pulse Power Incident
鈥?Both Medium and Low
Barrier Available
Outline C2
C
P
= 0.055 pF
ANGLE CUT 30-50擄
ALTERNATE 0.13 (.005)
DIA. HOLE 1.5 (0.06)
FROM END
CATHODE
Package Characteristics
These diodes are designed for
microstrip and stripline use. The
kovar leads provide good
continuity of transmission line
impedance to the diode. Outline
C2 is a plastic on ceramic
package. Outline H2 has a metal
ceramic hermetic seal. The
ceramic is alumina. Metal parts
are gold plated kovar.
0.10
(0.004)
TYP.
0.46 (0.018)
0.30 (0.012)
1.40 (0.055)
1.14 (0.045)
SQUARE
3.81 (0.150)
MIN.
Description/Applications
This family consists of medium
barrier and low barrier beam lead
diodes mounted in easily handled
carrier packages. Low barrier
diodes provide optimum noise
figure at low local oscillator drive
levels. Medium barrier diodes
provide a wider dynamic range for
lower distortion mixer designs.
Application Note 976 presents
design techniques for an X-Band
mixer.
Note:
For new designs, the
HSMS-286X and HSMS-820X series of
surface mount microwave diodes are
recommended.
0.36 (0.014)
MAX.
1.27 (0.050)
MAX.
DIMENSIONS IN MILLIMETERS AND (INCHES).
Outline H2
C
P
= 0.175 pF
The hermetic package, outline H2,
is capable of passing many of the
environmental tests of MIL-STD-
750. The applicable solderability
test is reference 2031.1: 260擄C,
10 seconds.
2.59 (0.102)
2.06 (0.081)
LID DIA.
CATHODE
0.58 (0.023)
0.43 (0.017)
2.64 (0.104)
2.34 (0.092)
3.30 (0.130)
SQUARE
MIN.
0.20 (0.008)
0.10 (0.004)
0.89 (0.035)
0.64 (0.025) 0.18 (0.007)
KOVAR LEADS,
Au PLATED
0.08 (0.003)
DIMENSIONS IN MILLIMETERS AND (INCHES).
3-57
5965-8846E
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2
3
4
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