鈥?Consult Data Sheet Nos. 23003 and 23004 for Aries BallNest鈩?/div>
Socket.
鈥?Socket body is UL 94V-0 FR-4.
(PPS).
鈥?Contacts are Beryllium Copper Alloy per QQ-C-533.
鈥?Contact plating is either 100碌 [2.54碌m] min. 90/10 Tin/Lead per MIL-T-
10727 or 10碌 [.25碌m] min. Gold per MIL-G-45204 over 30碌 [.76碌m]
Nickel per QQ-N-290.
鈥?Solder ball terminations are 90/10 Lead/Tin.
鈥?Solder paste is 63/37 eutectic.
鈥?Solder mask is 鈥渄ryfilm.鈥?/div>
鈥?Inductance鈮?畏H/cont. @ 100MHz approx. (under testing).
鈥?Capacitance鈮?pf/contact @ 100MHz approx. (under testing).
鈥?Contact resistance=10mOhms initial, 20mOhms @10 cycles
(under testing).
鈥?Durability=10 cycles max.; up to 50 cycles with SnapAdapt
TM
pin.
鈥?Insertion Force=50 grams/contact avg. (approximate);
40 grams/contact initial when used with SnapAdapt
TM
pin.
鈥?Withdrawal Force=20 grams/contact max. (approximate).
鈥?Socket accepts BGA devices with .030 [.76] dia. balls.
MOUNTING CONSIDERATIONS:
鈥?Suggested PCB pad size=.025鹵.003 [.64鹵.08] dia.
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
ORDERING INFORMATION
(for socket w/out corner guides only)
XXX-BGXXXXX-7XX
No. of positions
(256 shown)
Ball Grid Array
Footprint designator
(assigned by factory)
Pitch
U=1.50mm
V=1.27mm
A
LL
DIMENSIONS
:
INCHES
[
MILLIMETERS
]
鈥淎鈥?BGA PACKAGE SIZE + .085 [2.29]
unless otherwise specified
鈥淏鈥?(NO. OF POSITIONS PER ROW - 1) X BGA PITCH
鈥淐鈥?BGA PACKAGE SIZE + .015 [.25]
Use Aries鈥?BGA
Note: Part number assigned by
鈥淒鈥?BGA PACKAGE SIZE + .060 [1.52]
factory when ordering
Order Sheet, Data
socket with corner guides.
Sheet No. 23000, for
All tolerances 鹵 .005 [.13]
Plating:
0=Tin
1=Gold
Contact Type:
7=BallLock surface mount
solder ball contact
prompt quotations.
BGA Package with SMT
SnapAdapt鈩?pins in lieu of solder
balls. Consult Data Sheet No.
23012 and 23013 for details.
BGA Package w/ .030 [.76] dia.
solder balls
Optional
corner
guides
BallLock鈩?CONTACT
Corner guides not used
with SnapAdapt鈩?pins.
NORTH AMERICA
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX: (908) 996-3891
UK/IRELAND/GB
TEL: +44 870 240 0249
FAX: +44 1653 600493
uking@arieselec.com
EUROPE/MAINLAND/HOLLAND
TEL: +31 78 615 94 65
FAX: +31 78 615 43 11
23002
europe@arieselec.com
REV.E
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
http://www.arieselec.com 鈥?info@arieselec.com
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