Transistor
2SD1051
Silicon NPN epitaxial planer type
For low-frequency power amplification
Complementary to 2SB0819 (2SB819)
6.9鹵0.1
1.5
2.5鹵0.1
1.0
Unit: mm
G
R
0.
7
G
1.0鹵0.1
0.85
(Ta=25藲C)
Ratings
50
40
5
3
1.5
1
150
鈥?5 ~ +150
Unit
V
V
V
A
A
W
藲C
藲C
1:Base
2:Collector
3:Emitter
2.5
2.5
3
2
1
Parameter
Collector to base voltage
Collector to emitter voltage
Emitter to base voltage
Peak collector current
Collector current
Collector power dissipation
Junction temperature
Storage temperature
*
Symbol
V
CBO
V
CEO
V
EBO
I
CP
I
C
P
C*
T
j
T
stg
EIAJ:SC鈥?1
M Type Mold Package
Printed circuit board: Copper foil area of 1cm
2
or more, and the board
thickness of 1.7mm for the collector portion
I
Electrical Characteristics
Parameter
Collector cutoff current
Emitter cutoff current
Collector to base voltage
Collector to emitter voltage
Forward current transfer ratio
Collector to emitter saturation voltage
Base to emitter saturation voltage
Transition frequency
Collector output capacitance
(Ta=25藲C)
Symbol
I
CBO
I
CEO
I
EBO
V
CBO
V
CEO
h
FE*1
V
CE(sat)
V
BE(sat)
f
T
C
ob
Conditions
V
CB
= 20V, I
E
= 0
V
CE
= 10V, I
B
= 0
V
EB
= 5V, I
E
= 0
I
C
= 1mA, I
E
= 0
I
C
= 2mA, I
B
= 0
V
CE
= 5V, I
C
= 1A
*2
I
C
= 1.5A, I
B
= 0.15A
*2
I
C
= 2A, I
B
= 0.2A
*2
V
CB
= 5V, I
E
= 鈥?.5A
*2
, f = 200MHz
V
CB
= 20V, I
E
= 0, f = 1MHz
150
45
*2
min
typ
1.25鹵0.05
I
Absolute Maximum Ratings
0.55鹵0.1
0.45鹵0.05
max
1
100
10
4.1鹵0.2
4.5鹵0.1
G
High collector to emitter voltage V
CEO
.
Large collector power dissipation P
C
.
M type package allowing easy automatic and manual insertion as
well as stand-alone fixing to the printed circuit board.
2.4鹵0.2 2.0鹵0.2 3.5鹵0.1
I
Features
1.5 R0.9
R0.9
0.4
1.0
Unit
碌A(chǔ)
碌A(chǔ)
碌A(chǔ)
V
V
50
40
80
120
220
1
1.5
V
V
MHz
pF
Pulse measurement
*1
h
FE
Rank classification
Q
80 ~ 160
R
120 ~ 220
Note.) The Part number in the Parenthesis shows conventional part number.
Rank
h
FE
1
1
2
3
