Collector Current 鈭?/div>
Continuous
Peak
Base Current
V
EB
I
C
5.0
25
50
Vdc
Adc
I
B
7.5
Adc
Total Device Dissipation @ T
C
= 25擄C
Derate above 25擄C
Operating and Storage Junction
Temperature Range
P
D
200
1.15
W
W/擄C
擄C
T
J
, T
stg
鈥?65 to + 200
MARKING DIAGRAM
2N588xG
AYYWW
MEX
2N588x
G
A
YY
WW
MEX
THERMAL CHARACTERISTICS
Characteristic
Symbol
q
JC
Max
Unit
= Device Code
x = 3, 4, 5, or 6
= Pb鈭扚ree Package
= Assembly Location
= Year
= Work Week
= Country of Origin
Thermal Resistance, Junction鈭抰o鈭扖ase
0.875
擄C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates JEDEC registered data. Units and conditions differ on some
parameters and re鈭抮egistration reflecting these changes has been requested.
All above values most or exceed present JEDEC registered data.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Preferred
devices are recommended choices for future use
and best overall value.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
漏
Semiconductor Components Industries, LLC, 2006
1
March, 2006 鈭?Rev. 11
Publication Order Number:
2N5883/D