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27C256-30I/L Datasheet

  • 27C256-30I/L

  • 256K (32K x 8) Low-Voltage CMOS EPROM

  • 132.49KB

  • 10頁

  • MICROCHIP   MICROCHIP

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Obsolete Device
27LV256
256K (32K x 8) Low-Voltage CMOS EPROM
FEATURES
鈥?Wide voltage range 3.0V to 5.5V
鈥?High speed performance
- 200 ns access time available at 3.0V
鈥?CMOS Technology for low power consumption
- 8 mA Active current at 3.0V
- 20 mA Active current at 5.5V
- 100
碌A(chǔ)
Standby current
鈥?Factory programming available
鈥?Auto-insertion-compatible plastic packages
鈥?Auto ID aids automated programming
鈥?Separate chip enable and output enable controls
鈥?High speed 鈥淓xpress鈥?programming algorithm
鈥?Organized 32K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
- 32-pin PLCC package
- 28-pin SOIC package
- Tape and reel
鈥?Data Retention > 200 years
鈥?Available for the following temperature ranges:
- Commercial:
0擄C to +70擄C
- Industrial:
-40擄C to +85擄C
PACKAGE TYPES
PDIP
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
SS
鈥?
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
27LV256
32
31
30
4
3
2
1
A7
A12
V
PP
NU
Vcc
A14
A13
PLCC
A6
A5
A4
A3
A2
A1
A0
NC
O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A8
A9
A11
NC
OE
A10
CE
O7
O6
27LV256
14
15
16
17
18
19
SOIC
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
SS
O1
O2
V
SS
NU
O3
O4
O5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
DESCRIPTION
The Microchip Technology Inc. 27LV256 is a low volt-
age (3.0 volt) CMOS EPROM designed for battery
powered applications. The device is organized as a
32K x 8 (32K-Byte) non-volatile memory product. The
27LV256 consumes only 8 mA maximum of active cur-
rent during a 3.0 volt read operation therefore improv-
ing battery performance. This device is designed for
very low voltage applications where conventional 5.0
volt only EPROMS can not be used. Accessing individ-
ual bytes from an address transition or from power-up
(chip enable pin going low) is accomplished in less than
200 ns at 3.0V. This device allows systems designers
the ability to use low voltage non-volatile memory with
today鈥檚' low voltage microprocessors and peripherals in
battery powered applications.
A complete family of packages is offered to provide the
most flexibility in applications. For surface mount appli-
cations, PLCC or SOIC packaging is available. Tape
and reel packaging is also available for PLCC or SOIC
packages.
28
27
26
25
24
23
22
21
20
19
18
17
16
15
20
V
CC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
27LV256
餂?/div>
2004 Microchip Technology Inc.
DS11020H-page 1

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