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27C256

256K (32K x 8) CMOS EPROM

FEATURES

鈥?High speed performance

- 90 ns access time available

鈥?CMOS Technology for low power consumption

- 20 mA Active current

- 100

碌

A Standby current

鈥?Factory programming available

鈥?Auto-insertion-compatible plastic packages

鈥?Auto ID aids automated programming

鈥?Separate chip enable and output enable controls

鈥?High speed 鈥渆xpress鈥?programming algorithm

鈥?Organized 32K x 8: JEDEC standard pinouts

- 28-pin Dual-in-line package

- 32-pin PLCC Package

- 28-pin SOIC package

- 28-pin Thin Small Outline Package (TSOP)

- 28-pin Very Small Outline Package (VSOP)

- Tape and reel

鈥?Data Retention > 200 years

鈥?Available for the following temperature ranges:

- Commercial:

0藲C to +70藲C

- Industrial:

-40藲C to +85藲C

- Automotive:

-40藲C to +125藲C

PACKAGE TYPES

TSOP

OE

A11

A9

A8

A13

A14

V

CC

V

PP

A12

A7

A6

A5

A4

A3

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

A10

CE

D7

D6

D5

D4

D3

V

SS

D2

D1

D0

A0

A1

A2

27C256

PLCC

4

3

2

1

32

31

30

A7

A12

V

PP

NU

Vcc

A14

A13

A6

A5

A4

A3

A2

A1

A0

NC

O0

5

6

7

29

28

27

8

9

10

11

12

13

14

15

16

26

25

24

23

22

21

A8

A9

A11

NC

OE

A10

CE

O7

O6

17

18

19

DIP/SOIC

V

PP

A12

A7

A6

A5

A4

A3

A2

A1

A0

O0

O1

O2

V

SS

O1

O2

V

SS

NU

O3

O4

O5

1

2

3

4

5

6

7

8

9

10

11

12

13

14

DESCRIPTION

The Microchip Technology Inc. 27C256 is a CMOS

256K bit electrically Programmable Read Only Memory

(EPROM). The device is organized as 32K words by 8

bits (32K bytes). Accessing individual bytes from an

address transition or from power-up (chip enable pin

going low) is accomplished in less than 90 ns. This very

high speed device allows the most sophisticated micro-

processors to run at full speed without the need for

WAIT states. CMOS design and processing enables

this part to be used in systems where reduced power

consumption and reliability are requirements.

A complete family of packages is offered to provide the

most 鏗俥xibility in applications. For surface mount appli-

cations, PLCC, SOIC, VSOP or TSOP packaging is

available. Tape and reel packaging is also available for

PLCC or SOIC packages.

28

27

26

25

24

23

22

21

20

19

18

17

16

15

20

27C256

27C256

V

CC

A14

A13

A8

A9

A11

OE

A10

CE

O7

O6

O5

O4

O3

VSOP

OE

A11

A9

A8

A13

A14

V

CC

V

PP

A12

A7

A6

A5

A4

A3

22

23

24

25

26

27

28

1

2

3

4

5

6

7

21

20

19

18

17

16

15

14

13

12

11

10

9

8

A10

CE

O7

O6

O5

O4

O3

V

SS

O2

O1

O0

A0

A1

A2

27C256

漏

1996 Microchip Technology Inc.

DS11001L-page 1

This document was created with FrameMaker 4 0 4

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